Signal Integrity (SI) Applications Engineer
Descripción
Founded in 1976, Samtec is a privately held, $1 Billion global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service.
** SIGNAL INTEGRITY (SI) APPLICATIONS ENGINEER **
- Perform component and system levels simulations to aid in the design-in of products.
 - Use novel techniques in modeling & simulation to design new connectors, cable assemblies, and connector evaluation PCBs.
 - Develop world-class connectors and cable assemblies on tight timelines.
 - Guide and direct the activities of cross-functional team(s) per the priorities set by engineering management & learnings from SI simulations/measurements on developing major new products.
 - Perform high-speed empirical and analytical signal integrity evaluations of interconnects.
 - Validate designs and correlate measurement with simulations and test using VNA, TDR and Oscilloscope.
 - Support released products including, optimization, characterization, and application support.
 - Create technical documentation and white papers.
 - Utilize project management skills and problem-solving ability.
 - Travel for training, sales support or shows and events.
 - Prioritizing jobs and multitasking.
 - Train and support engineers across experience levels in technical knowledge, and software tools.
 
- 5 years minimum experience in Signal Integrity including a high-speed electrical test environment.
 - Experience using commercial 3D field solvers to study electromagnetic effects, with strength in Ansys software (HFSS, SI Wave, 3D Layout) highly preferred.
 - Experience with system-level tools (Keysight ADS, Cadence Allegro, HyperLynx…).
 - Experience with SI test equipment (TDR, VNA, Oscilloscope...).
 - Familiarity with high volume interconnect manufacturing methods & processes is a plus.
 - Knowledge of PCB design and fabrication methods.
 - Programming using MATLAB/Python is a plus.
 - Willing to learn new methods and technologies.
 - Excellent communication skills is a must for interacting with internal and external customers.
 
- Bachelor’s Degree in Electrical Engineering, Physics, or related field.